Abstract: Packaging is undergoing a major paradigm shift and promises to take up the lag caused by the slowing down of CMOS scaling. In this paper, we examine these shifts that have been driven by the scaling of key packaging metrics such as bump pitch, trace pitch, inter-die spacing and alignment. The goal of advanced packaging is to enable the same benefits that Moore/Dennard scaling has accomplished for CMOS viz. density, performance, power, and cost. The vehicles that advanced packaging employs are somewhat different: dielets/chiplets, advanced assembly techniques, simplified inter-chip communication protocols and cost optimization via the use of optimized heterogeneous technologies. Another important aspect of advanced packaging is the adoption and adaptation of silicon technology methods to packaging. In this talk we will discuss these technologies and some instantiation examples that we have developed at UCLA.

Bio: Subramanian S. Iyer (Subu) is Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical  Engineering  Department  and  a  joint  appointment  in  the  Materials  Science  and  Engineering  Department at the University of California at Los Angeles. He is Director of the Center for Heterogeneous Integration  and  Performance  Scaling  (UCLA  CHIPS).  Prior  to  that  he  was  an  IBM  Fellow.  His  key  technical  contributions have been the development of the world’s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable  devices as well as the first commercial interposer and 3D integrated products. He also was among the first to commercialize bonded SOI for CMOS applications through a start‐up called SiBond LLC. More recently, he has been exploring new packaging paradigms and device innovations that may enable wafer‐scale architectures, in‐memory analog compute and medical engineering applications. He has published over 300 papers and holds over 75 patents. He has received several outstanding technical achievements and corporate awards at IBM. He is an IEEE Fellow, an APS Fellow, an iMAPS Fellow and a Distinguished Lecturer of the IEEE EDS and EPS and a  member of the Board of Governors of IEEE EPS. He is also a Fellow of the National Academy of Inventors. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012 and the 2020 iMAPS Daniel C. Hughes Jr Memorial award and the iMAPS distinguished educator award in 2021.