CRNCH Summit 2022 - Madhavan Swaminathan - Dielet Integration and High Performance Computing
From Jeffrey Young
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From Jeffrey Young
In this presentation we will cover the landscape on the state of the art for HI and focus on some new technologies being developed at the Packaging Research Center @ Georgia Tech in the area of high performance computing.
Bio: Madhavan Swaminathan is the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC), Georgia Tech (GT) (http://www.prc.gatech.edu). He also serves as the Site Director for the NSF Center for Advanced Electronics through Machine Learning (CAEML: https://publish.illinois.edu/advancedelectronics/) and Leads the Heterogeneous Integration area, at the SRC JUMP ASCENT Center (https://ascent.nd.edu/). Prior to joining GT, he was with IBM working on packaging for supercomputers. He is the author of 530+ refereed technical publications and holds 31 patents. He is the primary author and co-editor of 3 books and 5 book chapters, founder and co-founder of two start-up companies, and founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is an IEEE Fellow and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society.