The rapid development of faster, cheaper, and more powerful computing has led to some of the most important technological and societal advances in modern history. However, the physical means associated with enhancing computing capabilities at the device and die levels have also created a very challenging set of circumstances for keeping electronic devices cool, a critical factor in determining their speed, efficiency, and reliability. With advances in nanoelectronics and the emergence of new application areas such as three-dimensional chip stack architectures and flexible electronics, now more than ever there are both needs and opportunities for novel materials and strategies to help address some of these pressing thermal management challenges. In this talk, our group’s work in the areas of new materials, advanced sensing, and developing a more robust understanding of thermal energy transport across length scales is presented, with emphasis on research areas which leverage industry-relevant materials science and microfabrication principles.